Publication Details

Author:H.U. Akay, N.H. Paydar, G. Glogas, H. Zhang
Title:Viscoelastic Study of a Conductive Adhesive for Electronic Packages - Part 2: Thermal Stress Analysis Using the Finite Element Method
Category:International Refereed Journal
Index:Others
Published Place:İnternational Journal of Microelectronic Packaging
Year:1998
Volume:1
Pages:225-233
Place: